Arrangement of computing assets in a data center

ABSTRACT

A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/624,909, titled “Arrangement of Computing Assets in a Data Center”and filed on Sep. 22, 2012, the contents of which are incorporated byreference herein in their entirety.

BACKGROUND

1. Field of Disclosure

The present disclosure relates to arranging computing assets in a datacenter.

2. Description of Related Art

Data centers include a large number of computing assets that generate asignificant amount of heat. To ensure proper cooling of the computingassets, data centers may arrange the computing assets into a hotaisle/cold aisle layout. In a hot aisle/cold aisle layout, computingassets are placed into equipment racks that are arranged so that thefronts of the racks face each other. An air conditioning unit feeds coldair into an aisle that the rack fronts face to create a cold aisle. Thebacks of the equipment racks also face each other, creating hot aisles.The air from the hot aisles may be cooled and re-circulated into thecold aisles.

Although the hot aisle/cold aisle layout has become popular in manymodern data centers, the hot aisle/cold aisle layout is spaceinefficient and limits the density of computing assets in the datacenter. For example, each equipment rack has multiple rack-postscreating gaps between adjacent racks that cannot be filled withcomputing assets. As another example, each equipment rack includes alarge number of fans located along the back or the front of the rack tomove air from the cold aisle into the hot aisle. The fans also occupy asignificant amount of space that cannot be filled with any computingassets.

SUMMARY

Embodiments of the present disclosure include a system with aspace-efficient arrangement of computing assets that increases thedensity of computing assets while cooling the computing assets. In oneembodiment, a plurality of backplanes form a perimeter of a centralregion of a backplane structure. A plurality of computing assets arecoupled to the backplanes and extend away from the central region of thebackplane structure. For example, the backplane structure is cylindricaland the computing assets extend radially away from an axis of thecylinder when coupled to the backplanes. A plurality of air intakeopenings are located along the perimeter of the backplane structure. Forexample, the air intake openings are between pairs of backplanes or maybe included within one or more backplanes. An exhaust duct is coupled toan exhaust opening of the backplane structure and configured to directair away from the backplane structure and is coupled to an air movingdevice. When the air moving device is operational, air flows across thecomputing assets through the air intake openings towards the centralregion of the backplane structure and into the exhaust duct, whichdirects the air away from the backplane structure.

The features and advantages described in this disclosure and in thefollowing detailed description are not all-inclusive, and particularly,many additional features and advantages will be apparent to one ofordinary skill in the relevant art in view of the drawings,specification, and claims hereof.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a system for cooling computing assets, according to anembodiment.

FIG. 2 is a system for cooling computing assets, including a backplanestructure filled with the computing assets, according to an embodiment.

FIG. 3 is a system for cooling computing assets, including multiplebackplane structures arranged into an equipment rack, according to anembodiment.

FIG. 4 is a system for cooling computing assets, including multiplebackplane structures sharing a common exhaust duct, according to anembodiment.

FIG. 5 is a system for cooling computing assets, including multiplebackplane structures in an equipment rack that share a common exhaustduct, according to an embodiment.

The figures depict embodiments of the present disclosure for purposes ofillustration only. One skilled in the art will readily recognize fromthe following description that alternative embodiments of the structuresand methods illustrated herein may be employed without departing fromthe principles, or benefits touted, of the disclosure described herein.

DETAILED DESCRIPTION

System Overview

FIG. 1 is one embodiment of a system for computing asset cooling. Thesystem may be found in a data center or other type of informationtechnology facility. The system includes a backplane structure 102 towhich computing assets are connected. The backplane structure 102arranges the computing assets in a space efficient configuration whileallowing the computing assets to be easily cooled. Computing assets mayinclude any type of electrical equipment that is used in a computingenvironment. Examples of computing assets include storage drives (e.g.hard drives, solid state drives), storage controllers, computer serversand networking equipment.

The backplane structure 102 includes a distribution board 104, multiplebackplanes 106, multiple air intake openings 108 and an exhaust opening110 that together form a three dimensional shape. In the example of FIG.1, the backplane structure 102 has a cylindrical shape having a hollowcavity in the central region of the cylinder. As shown in FIG. 1, theaxis 114 denotes the approximate center of backplane structure 102. Thedistribution board 104 forms an upper base of the backplane structure102 while the backplanes 106 surround the central region of thebackplane structure 102 and form the perimeter of the backplanestructure 102.

As used herein, “cylindrical” may include both perfect cylinders as wellas substantially cylindrical shapes that resemble that of a cylinder.One example of a substantially cylindrical shape is a geometric prismhaving a large number of faces (e.g. greater than or equal to 8 faces).A geometric prism is a polyhedron with n-sided polygonal bases and nfaces connecting the bases. The backplane structure 102 in FIG. 1 may bea prism because each of the backplanes 106 is likely to be a flat,planar backplane. In other embodiments the backplane structure 102 maybe in a different shape so long as the backplane structure 102 has anempty central region so that air can be drawn into the backplanestructure 102. Examples include half cylinders and geometric prismshaving a low number of faces (e.g. less than 8 faces), such asrectangular and triangular prisms.

The distribution board 104 forms a base of the backplane structure 102and is perpendicular to the axis 114 of the backplane structure. Thedistribution board 104 includes power lugs 103 connected to a set ofpower cables 135. The distribution board 104 receives power through theset of power lugs 130 and distributes the power to the individualbackplanes 106. In some embodiments, the distribution board 104 alsoincludes signaling connections allowing the individual backplanes tocommunicate with each other. For example, the distribution board 104 isa printed circuit board (PCB) including metal traces distributing powerand signaling information to backplanes 106.

The individual backplanes 106 are coupled to the distribution board 104in a manner so that they are parallel to the axis 114 of the backplanestructure 102 and form the perimeter of the backplane structure 102.Similar to the distribution board 104, the individual backplanes 106 maybe PCBs including metal traces for distributing power and signalinginformation from the distribution board 104 to electrical connectors 112of the backplanes 106. The electrical connectors 112 are located on theoutside face of the backplanes 106 and are configured to carry power andsignaling information to computing assets (e.g., storage drive 130 andstorage controller 145) that are coupled to the electrical connectors112.

When coupled to the backplanes 106 via the connectors 112, the computingassets (e.g., storage drive 130, storage controller 145) extend outwardsfrom the backplane structure 102. In other words, an end of a computingasset connected to the backplane structure 102 is closer to the centralregion of the backplane structure 102 than an opposite end of thecomputing asset. For example, as shown in FIG. 1, the computing assetsmay extend outwards from the axis 114 of the backplane structure 102 ina radial direction (e.g., along the same direction as a radius of thebackplane structure 102). In other embodiments, the computing assetsextend outwards from a central region of the backplane structure 102without extending precisely in the radial direction.

The majority of computing assets coupled to the backplane structure 102may be storage drives 130, creating a dense storage array. The storagedrives 130 communicate with a network or server (not shown) via thestorage controller 145. In one embodiment, a variety of types ofcomputing assets, such as storage drives, servers and networkingequipment, may be connected to a single backplane structure 102.

The backplane structure 102 also includes air intake openings 108located around the perimeter of the backplane structure 102. In FIG. 1,the air intake openings 108 are located between adjacent pairs ofbackplanes 106. In other embodiments, the air intake openings 108 may beopenings in the backplanes 106 themselves. The distribution board 104also includes an air exhaust opening 110. An exhaust duct 116 is coupledto the air exhaust opening 110 and is configured to direct air away fromthe backplane structure 102.

An air moving device 125 (e.g., a fan) is coupled to the air exhaustopening 110 through the exhaust duct 116. When the air moving device 125is operating, air is pulled across the computing assets and into thecenter of the backplane structure 102 through the intake openings 108.The moving air extracts heat from the computing assets and the airflowdirects the extracted heat away from the computing assets. Air heated bythe computing assets is directed to the center of the backplanestructure 102 and out of the backplane structure 102 through the exhaustopening 110. Hence, the airflow draws cold air across the surface ofcomputing assets through the gaps between the computing assets,absorbing heat generated by the computing assets and cooling thecomputing assets. The heated air is directed through the air exhaustopening 110, where it can be recycled back into cold air or releasedoutside of the data center.

The arrangement of electrical assets shown in FIG. 1 allows for a highdensity of computing assets while allowing the computing assets to beefficiently cooled. For example, moving air across many computing assetsusing a central air moving device 125 reduces the space occupied by thefans, rather than by computing assets, in conventional configurations.While increasing the density of computing asset storage, the system 100allows the computing assets to be efficiently cooled by drawing cold airfrom the outside of the backplane structure 102 and expelling the hotair through the exhaust duct 116.

In one embodiment, the backplane structure 102 has a rotisserieconfiguration that allows the backplanes 106 and computing assets can berotated around the axis 114 of the backplane structure 102. Thisconfiguration increases the accessibility of the computing assets. Forexample, when the backplane structure 102 is mounted into an equipmentrack, the rotisserie configuration allows an administrator of a datacenter to more easily replace computing assets connected to thebackplane structure 102.

In another embodiment, a lower base of the backplane structure 102 maybe covered with a solid cover 150, blocking airflow through the bottomof the backplane structure 102. The solid cover 150 air to be drawn intothe backplane structure 102 through the air intake openings 108,increasing the airflow across the computing assets attached to thebackplane structure 102. In some embodiments, the solid cover 150covering the lower base of the backplane structure 102 may include anadditional intake opening that may be coupled to the exhaust opening ofother backplane structures 102 allowing multiple backplane structures102 to share a common exhaust duct, as will be explained in conjunctionwith FIGS. 4 and 5.

FIG. 2 is a system for computing asset cooling including a backplanestructure 102 filled with computing assets. The system shown by FIG. 2is similar to the system in FIG. 1, but has a backplane structure 102filled with storage drives 130, obscuring the view of much of thebackplane structure 102. In the system of FIG. 2, the exhaust duct 116is perpendicular to an axis of the backplane structure 102.

In the system of FIG. 2, like the system shown by FIG. 1, an air movingdevice 125 draws cold air across the storage drives 130 into the centerof the backplane structure 102. This airflow cools the storage drives130 and causes hot air to collect in the center of the backplanestructure 102. The hot air is then drawn out of the backplane structure102 through the exhaust duct 116.

FIG. 3 illustrates a system for asset cooling including multiplebackplane structures 102 arranged into an equipment rack 302. Theequipment rack 302 may be located in a data center and cooled with coldair provided by an air conditioning unit of the data center. In thesystem of FIG. 3, the equipment rack 302 includes three rows ofbackplane structures 102 including storage devices 130 and/or othercomputing assets. Servers 304 are positioned below each backplanestructure 102 in the equipment rack 302. However, in other embodiments,the servers 304 may be located in any suitable location within theequipment rack 302. In one embodiment, the storage drives 130 in abackplane structure 102 are managed by a server 304 proximate to thebackplane structure, such as the server 304 located below the backplanestructure 102. Other arrangements of computing assets and backplanestructures 102 in the equipment rack 302 are also possible. For example,a column within the equipment rack 302 may include servers 302 ratherthan backplane structures 102.

FIG. 4 is a system for cooling computing assets that includes multiplebackplane structures 102 sharing a common exhaust duct 116. In theexample of FIG. 4, multiple backplane structures 102 have a common axis,forming a tubular trunk extending through each of the backplanestructures 102. In FIG. 4, a topmost backplane structure 102 isconnected to one or more network switches 402 to communicate data fromthe computing assets in other backplane structures 102 in the system toother devices. As shown in FIG. 4, additional backplane structures 102in the system below the topmost backplane structure 102 includecomputing assets, such as storage drives 130 and servers 150.

In the system, the exhaust opening at the top of each backplanestructure 102 is connected to an intake opening at the bottom of thenext adjacent backplane structure 102, forming a common exhaust duct 116shared between all backplane structures 102 in the system. Hence, an airmoving device 125, such as a fan, may be used to draw air acrosscomputing assets included in each of the backplane structures 102. Whenthe air moving device 125 operational, it draws cold air across thecomputing assets (e.g., storage devices 130, servers 304, networkswitches 402) of each of the backplane structures 102 into the commonexhaust duct 116 in the center of the backplane structures 102, whichdirects the air out of the backplane structures 102.

FIG. 5 is a system for cooling computing assets include includingmultiple backplane structures 102 sharing a common exhaust duct 116 inan equipment rack 302. As shown in FIG. 5, the equipment rack 302 holdsmultiple rows of backplane structures 102 filled with storage drives 130and/or other computing assets. Each row includes one or more backplanestructures 102 and the exhaust opening of each backplane structure 102is coupled to an intake opening of an adjacent backplane structure 102.The last backplane structure in each row 102 is coupled to the commonexhaust duct 116. Hence, the rows of backplane structures 102 share thesame exhaust duct 116 and air moving device 125.

When the air moving device 125 is powered on, air is drawn across thecomputing assets of the backplane structures 102 and into the commonexhaust duct 116 for direction away from the backplane structures. Inone embodiment, rows of servers 304 are positioned between the rows ofbackplane structures 102. Exhaust outputs of the servers 304 are alsocoupled to the common exhaust duct 116 to direct hot air generated bythe servers 304 away from the servers 304.

In one embodiment, the equipment rack 302 is located within a datacenter that not cooled using a hot aisle/cold aisle layout. For example,the entire data center is cooled to a desired temperature so cold airsurrounds the equipment rack 302. The cold air is drawn into thebackplane structures 102 and the servers 304 for absorbing heatgenerated by computing assets and the servers 304. The air moving device125 then draws the resulting hot air away from the backplane structuresand servers 304 via the common exhaust duct 116.

SUMMARY

The foregoing description of the embodiments of the disclosure has beenpresented for the purpose of illustration; it is not intended to beexhaustive or to limit the disclosure to the precise forms disclosed.Persons skilled in the relevant art can appreciate that manymodifications and variations are possible in light of the abovedisclosure.

The language used in the specification has been principally selected forreadability and instructional purposes, and it may not have beenselected to delineate or circumscribe the inventive subject matter. Itis therefore intended that the scope of the disclosure be limited not bythis detailed description, but rather by any claims that issue on anapplication based hereon. Accordingly, the disclosed embodiments areintended to be illustrative, but not limiting, of the scope of thedisclosure, which is set forth in the following claims.

What is claimed is:
 1. A system comprising: a plurality of boardsarranged around a perimeter of a structure, the plurality of boardssurrounding a central axis of the structure; a plurality of computingassets coupled to the boards; a central airflow path formed within theperimeter of the structure and generally parallel to the central axis ofthe structure; at least one air intake opening for the central airflowpath for supplying cooling airflow to the central airflow path; at leastone exhaust opening for the structure for directing the cooling airflowaway from the structure; and an air moving device coupled to the exhaustopening, the air moving device arranged to cause the cooling airflow toflow through the air intake opening along the central axis of thestructure and out through the exhaust opening, thereby cooling thecomputing assets coupled to the plurality of boards.
 2. The system ofclaim 1, wherein the air moving device coupled to the exhaust openingcomprises a fan coupled to the exhaust opening.
 3. The system of claim1, wherein the boards are parallel to the central axis of the structure.4. The system of claim 1, wherein the boards arranged around theperimeter of the structure are printed circuit boards arranged aroundthe perimeter of the structure.
 5. The system of claim 4, furthercomprising at least one electrical connector coupled to the printedcircuit boards, and at least one of the computing assets is coupled tothe electrical connector.
 6. The system of claim 1, wherein the boardsarranged around the perimeter of the structure are backplanes arrangedaround the perimeter of the structure.
 7. The system of claim 1, whereinthe at least one air intake opening includes a plurality of air intakeopenings.
 8. The system of claim 7, wherein the plurality of air intakeopenings are located along the perimeter of the structure between pairsof the boards.
 9. The system of claim 1, wherein the structure iscylindrical or prism shaped.
 10. The system of claim 1, furthercomprising: a distribution board coupled to boards and to a powersupply, the distribution board configured to provide power from thepower supply to the boards and configured to provide signalingconnections to the boards.
 11. The system of claim 1, wherein thecomputing assets comprise at least one storage drive, the storage drivecooled by the cooling airflow.
 12. The system of claim 1, wherein thecomputing assets comprise at least one of storage controllers, computerservers, or networking equipment.
 13. The system of claim 1, wherein thecomputing assets extend in a radial direction relative to the centralaxis of the structure.